Wafer Capacity and Capacity Utilization Report & Data This Report and Database covers: Wafer Capacity by Technology Node; Wafer Capacity Utilized by Technology Node; Wafer Capacity Utilized by Country; Wafer Capacity utilized by end market and Wafer Capacity Utilized by Wafer Size. Wafer Fabrication Capacity Utilized shown by IDM, Foundry and by Systgem House. Analyzes Wafer Starts by Technology Node for each wafer. Published monthly. Annual subscription. Technologies covered: CMOS, BiCMOS, SiGe, GaAs and Bipolar. Technology nodes covered: CMOS: 40nm to 1500nm. BiCMOS: 350nm to 1500nm. BIPOLAR: 350nm to1500nm. SiGe: 130nm to 350nm. GaAs: 250nm to 3000nm. End markets: Automotive, Consumer, Communications, Computer, Industrial, Instrumentation, Aerospace+Defense.